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News and Press Releases
IDsmart Admits In Court Document that e-Smart’s Technology was Used to Develop IDsmart’s Smart Card

Robert van Maasdijk Appointed to the Board of e-SMART Technologies, Inc.

e-SMART® Technologies Continues Delivery of Its New Super SMART™ Card in South Korea

e-SMART® Technologies To Deliver 20 Million “I AM”™ Super SMART™ Cards to Samsung S1

e-Smart® Technologies Delivers Its New Super Smart Card™ on Second Contract in South Korea

e-Smart® Technologies Delivers Its New Super Smart Card™ in South Korea

e-Smart® Technologies, Inc., Announces Next Generation Superthin Polyimide Flexible Circuit Biometric Super Smart Card™ card, the “i am”™ Card

e-Smart® Technologies, Inc. Responds to Information Subpoenas From Securities & Exchange Commission

e-Smart Technologies, Inc. Holds Shareholder Conference Call

Chairman's Newsletter November 2007

e-Smart® Technologies Responds to Press Release Issued By IDsmart LLC

Patent Issued for e-Smart® Technologies, Inc.'s First Biometric Match-on-Card Technology

e-Smart® Technologies Opens Engineering Production Center in Seoul, Korea

e-Smart® Selected for Gwangju City, Korea, 'Digital Ubiquitous Model City' Project

e-Smart® Technologies Welcomes New Chief Operating Officer

e-Smart® Technologies Receives $50 Million Commitment for Funding S. Korea and Worldwide Projects

e-Smart® Technologies to Grant World Developments Corporation Exclusive Rights in Africa

e-Smart® Technologies to Partner With World Developments Corporation

Chairman's Newsletter January 2007

 
 


Our System

As the critical problems of financial fraud and identity theft combine with the increasing threat of terrorism, nations and institutions throughout the world have turned to e-Smart® Technologies for the most advanced technological solution for safety, security and homeland defense…the Biometric Verification Security System (“BVS2™). e-Smart® Technologies is providing the future’s solutions NOW!

e-Smart® announces its next generation super thin polyimide flexible circuit biometric Super Smart Card™ which has been named "™ "




The new e-Smart® Super Smart Cards® are made with a super adhesion technology and a superthin polyimide flexible circuit, and, have a super strong adhesive substrate that secures its external surface to its internal circuitry. The embedded MPU instantly verifies the identity of the cardholder, and communicates with ISO standardized card readers and other devices. The new super thin polyimide flexible circuit with super adhesion technology and infrastructure enables e-Smart's® “” cards to be produced at lower costs, while providing higher security and what experts believe to be a tamper-proof card body and counterfeit-proof smart card.

e-Smart®'s “” Super Smart Card® can protect individual's identity, safety and security and empower people to say with confidence - “” safe, “” secure, “” cleared, “” important, — “” a Voice to be Heard" — “


The Super Smart Card™
Globally acknowledged as the world's first & only commercially available, validated, ISO compatible, contact and long-range wireless, totally secure, interoperable, multi-application, unique biometric smart card with fingerprint sensor & matching system completely on-card.
 
Super Smart Passport™
The first & only digital passport that authenticates passport holder’s identity via completely on-board fingerprint sensor and totally unique, secure biometric matching system, using long-range wireless powered via ISO standard 14443 antenna with no physical connection needed.

Super Smart Card™ & Super Smart Passport™
operate on e-Smart®’s advanced BVS2™ Platform – the one Interoperable Secure Platform needed by governments and institutions for all their data communication, securing privacy by making tampering or hacking into data on the BVS2™ platform or in transit virtually IMPOSSIBLE.

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©2008 e-Smart® Technologies, Inc.